The Capital University Loan Repayment Assistance Program (LRAP)
application process will open on October 1. Applications are due by November 15.
2012 LRAP Application
To be considered, all materials must be mailed in hardcopy
form and post-marked no later than November
15. Documents emailed or faxed will not be
considered. mail your materials to:
LRAP Administrator
C/O Shawn M. Beem
Capital University Law
School
303 E. Broad St.
Columbus, OH 43215
For more about eligibility, review the program information.